Research on a Novel Reliable MEMS Bistable Solid-State Switch

Received: 16 Jan 2022, Revised: 19 Jan 2022, Accepted: 05 Mar 2022, Available online: 29 Mar 2022, Version of Record: 29 Mar 2022

Bo He, Lou Wenzhong, Hengzhen Feng, Yuecen Zhao

Abstract


As a result of the unpredictable nature of extreme environments (including temperature, humidity, impact, and other factors), micro-electro-mechanical systems (MEMS) solid-state fuze control modules have an urgent requirement for a MEMS solid-state switch (MEMS-S3). In particular, this switch must remain stable without any energy input after a state transition (i.e., it must be bistable). In this paper, a MEMS bistable solid-state switch (MEMS-bS3) is designed that is based on the concept of producing a micro-explosion. The reliable state switching of the MEMS-bS3 is studied via heat conduction theory and verified via both simulations and experimental methods. The experimental results show that these switches can produce micro-explosions driven by 33 V/47 μF pulse energy. However, the metal film bridge (MFB) structures used in this switch with smaller dimensions (80×20 μm2, 90×30 μm2, and 100×40 μm2) could not enable the switch to realize a reliable state transition, and the state transition rate was less than 40%. When the MFB dimensions reached 120×60 μm2 or 130×70 μm2, the state transition rate exceeded 80%, and the response time was on the μs-scale.
MEMS-bS 3 model and state transition process. (a) component layers, (b) 3d model, and (c) state transition process.

MEMS-bS 3 model and state transition process. (a) component layers, (b) 3d model, and (c) state transition process.
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Multiphysics field simulation of the MEMS-bS 3 . (a), (b) cAd model, (c) temperature distribution, and (d) temperature contours.

Multiphysics field simulation of the MEMS-bS 3 . (a), (b) cAd model, (c) temperature distribution, and (d) temperature contours.
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comparison of temperature vs. time characteristics obtained via theoretical calculations with those obtained via simulations.

comparison of temperature vs. time characteristics obtained via theoretical calculations with those obtained via simulations.
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Process flow for fabrication of the MEMS-bS 3 .

Process flow for fabrication of the MEMS-bS 3 .
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Images of the MEMS-bS 3 : (a) optical microscope image, and (b) field emission scanning electron microscope image.

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Images of the MEMS-bS 



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