A Design of Experiments Approach towards Desired Flow Distribution through Manifolds in Electronics Cooling
Abstract
For rack-mounted electronics, flow distribution is desired as per the heat load characteristics. In the literature, attainment of flow uniformity through manifolds is highlighted and widely discussed as it has more applications. To attain desired flow distribution, the complexity of the problem increases. In the present paper, the Design of Experiments (DOE) along with response surface optimization is used to arrive at desired flow, which includes uniform flow also. A three-dimension, 10-channel Z-type manifold is considered for the study. This model is taken from experimentally verified and published data for which desired flow patterns are achieved. Flow requirement through each channel is set as a parameter for optimization and by the defined sample set under DOE, uniform flow and pattern flow are achieved by introducing suitable orifices. Multi-Objective Genetic Algorithm (MOGA) is used for obtaining orifice diameters. A good agreement is observed between the attained flow patterns and desired patterns. This approach is simple and can be implemented for industrial applications.
General framework of DoE for process/system.
…
Central composite design for two variables (left), three variables (right).
…
Sensitivity chart obtained from ANSYS workbench for natural flow configuration.
…
Velocity contour plot for natural flow distribution.
…
Mass flow distribution across channels for natural and uniform flow cases.
…
Description
Indexed in scopushttps://www.researchgate.net/publication/364514665_A_Design_of_Experiments_Approach_Towards_Desired_Flow_Distribution_Through_Manifolds_in_Electronics_Cooling |
Article metrics10.31763/DSJ.v5i1.1674 Abstract views : | PDF views : |
Cite |
Full Text![]() |
Conflict of interest
“Authors state no conflict of interest”
Funding Information
This research received no external funding or grants
Peer review:
Peer review under responsibility of Defence Science Journal
Ethics approval:
Not applicable.
Consent for publication:
Not applicable.
Acknowledgements:
None.